Despite a low TDP (3-5W), the datasheet warns about localized hotspots near the VMP accelerators. A thermal pad and a small copper spreader are mandatory for ambient temperatures above 85°C.
From the official datasheet summary and ISO 26262-compliant documentation:
The EyeQ4 datasheet is more than just a list of pins and voltages—it is a roadmap to understanding how mass-market autonomy was achieved in the late-2010s. With its blend of 28nm efficiency, 2.5 TOPS of dedicated vision power, and support for eight cameras, the EyeQ4 struck a critical balance between cost, thermal output, and real-world performance.
While the newer EyeQ5 and EyeQ6 dominate headlines for 7nm and 5nm processes, the EyeQ4 remains in active production, powering millions of vehicles on the road today. For any automotive engineer looking to build a robust, proven ADAS platform, a deep dive into the EyeQ4 datasheet is an essential first step.
Further Reading:
Last updated: October 2024. Specifications subject to change by manufacturer.
The Mobileye EyeQ4 is a high-performance vision system-on-chip (SoC) designed for Advanced Driver Assistance Systems (ADAS) and semi-autonomous driving. It provides approximately 2.5 teraflops of processing power while maintaining a low-power automotive-grade envelope of roughly 3W. Technical Specifications Summary
The EyeQ4 architecture is based on a heterogeneous computing model that assigns specific tasks to specialized cores for maximum efficiency. Feature Specification Details Processor Cores eyeq4 datasheet
4x multi-threaded 64-bit RISC MIPS CPUs (4 hardware threads each) Vision Accelerators
6x Vector Microcode Processors (VMP), 2x Multithreaded Processing Clusters (MPC), 2x Programmable Macro Arrays (PMA) Compute Power >2.5 Teraflops (or 2.5 TOPS depending on variant) Power Consumption ~3 Watts (up to 5W in some high-load configurations) Process Node
28nm Fully Depleted Silicon On Insulator (FD-SOI) by STMicroelectronics Camera Support Up to 8 cameras simultaneously at 36 FPS Safety Standard ISO 26262 compliant with ASIL-B(D) safety level Packaging Flip-Chip FBGA 784-pin; 22.5 x 22.5 x 1.7 mm EyeQ4 Variant Differences
Mobileye developed multiple versions of the chip to support different vehicle capabilities: EyeQ4-High (EyeQ4H)
: The most capable version, supporting trifocal front-sensing, surround-view systems (4 cameras), and sensor fusion with radar and laser scanners. EyeQ4-Medium (EyeQ4M)
: A cost-optimized variant with a subset of cores, typically used for monocular or trifocal camera configurations in standard ADAS applications. Key Interfaces and Connectivity
According to the EyeQ4 Product Brief, the chip includes the following I/O: Memory: Dual 32-bit LPDDR4 SDRAM interfaces at 1.6GHz. Network: 1Gb Ethernet port. Despite a low TDP (3-5W), the datasheet warns
Video Input: 4x MIPI CSI-2 Rx serial video ports and 1x parallel video port.
Automotive Buses: 3x CAN ports (>1Mbps), 3x UART, 3x I2C, and 4x SPI interfaces. Documentation and Resources Mobileye EyeQ4 Vision Processor Family - Yole Group
EyeQ4 Datasheet Write-up
The EyeQ4 is a high-performance, low-power System-on-Chip (SoC) designed for advanced driver-assistance systems (ADAS) and autonomous driving applications. Developed by Mobileye, a leading provider of computer vision and machine learning technologies, the EyeQ4 is a fourth-generation SoC that offers significant improvements in processing power, memory, and software capabilities compared to its predecessors.
Overview
The EyeQ4 datasheet provides an in-depth look at the SoC's architecture, features, and specifications. Here are some key highlights:
Key Features
The EyeQ4 datasheet highlights several key features that make it an attractive solution for ADAS and autonomous driving applications:
Applications
The EyeQ4 is designed for a range of ADAS and autonomous driving applications, including:
Conclusion
The EyeQ4 datasheet provides a comprehensive overview of Mobileye's latest SoC for ADAS and autonomous driving applications. With its powerful processing capabilities, large memory capacity, and support for a range of sensors and software frameworks, the EyeQ4 is well-suited for demanding applications like computer vision, machine learning, and autonomous driving. As the automotive industry continues to evolve towards more advanced driver-assistance systems and autonomous vehicles, the EyeQ4 is poised to play a key role in enabling these technologies.
The datasheet often references the necessity of Mobileye’s EyeQ Kit – a proprietary SDK. Important: The chip will not run arbitrary Linux or C++ code. It runs Mobileye’s closed software stack. Developers can add small accelerators via the Programmable Macro Array.
The EyeQ4 is offered in a FCBGA-484 package. Further Reading:
| Parameter | Value | |-----------|-------| | Package Dimensions | 17 mm × 17 mm | | Ball pitch | 0.8 mm | | Ball count | 484 | | Junction-to-case thermal resistance (θjc) | 2.5 °C/W | | Maximum junction temperature (Tj) | 105°C (150°C for short transients) |
Thermal design note: The datasheet recommends a 4-layer PCB with at least 6 thermal vias under the exposed die pad for conduction to chassis ground.